Laser Services Guide
Heisler Semiconductor provides advanced laser micromachining services for the semiconductor and electronics industries, specializing in high-precision marking, etching, and via drilling.
We enable rapid, cost-effective solutions for R&D, prototyping, and low-volume production with a focus on flexibility and quality.
Services Overview
We deliver high-precision laser services, including micro machining, micro hole drilling, cutting, marking, and patterning across a wide range of materials.
Our solutions help customers accelerate product development with unmatched speed, accuracy, and flexibility.
Materials We Process
Plastics
- Polyimide (Kapton)
- Polycarbonate
- PEEK
- LDPE
- HDPE
- Silicone
- ABS
- Nylon
- BoPET (Mylar)
Metals
- Stainless Steel
- Copper
- Brass
- Tantalum
- Titanium
- Aluminum
- Kovar
Electronics
- Semiconductors
- Glass
- Ceramics
- components
- PCBs
Micro Hole Drilling
Heisler Semiconductor LLC provides micro hole drilling services, delivering high-precision, laser-drilled features for applications such as micro vias, fluidic channels, and specialty apertures in advanced materials.
Micro Machining
Heisler Semiconductor LLC provides laser micro-machining services utilizing high-precision laser systems as micro-scale CNC tools for custom etching and structuring of advanced materials.
Laser Patterning
Heisler Semiconductor LLC offers laser patterning services for direct-write fabrication of micro-scale features, enabling rapid prototyping and custom patterning of metals, polymers, and other advanced materials.
Laser Marking
Heisler Semiconductor LLC provides laser marking services for traceability applications, including serial numbers, QR codes, and compliance markings on semiconductor and electronic components.
Laser Cutting
Heisler Semiconductor LLC offers laser cutting services for precise depanelization of PCBs, stencil fabrication, and high-accuracy cutting of thin and delicate materials.
Laser Processing in Semiconductor Manufacturing
In the semiconductor industry, laser processing is a cornerstone for advanced manufacturing processes, enabling high precision and efficiency. Key applications include:
Wafer Dicing
Lasers are used to cut semiconductor wafers into individual chips with minimal kerf loss and reduced mechanical stress compared to traditional methods.
Drilling Through-Semiconductor-Vias (TSVs)
Laser drilling creates precise, high-aspect-ratio vias for vertical electrical interconnects in 3D stacked chips.
Surface Patterning
Lasers enable the creation of intricate patterns for photonic and electronic applications, including micro-optics and sensors.
Thin Film Removal
Selective ablation of thin films ensures clean, damage-free processing for applications like photovoltaics and MEMS.
Advanced Packaging
Laser marking on interposers and semiconductor packages ensures traceability and alignment for assembly.
