U.S.–Based Precision Laser Services
Heisler Semiconductor LLC provides precision laser marking and engraving for industrial, medical, and electronic components, all performed in our Baltimore, Maryland facility.
From serial numbers and QR codes to compliance and regulatory markings, our laser services deliver micron-level accuracy and permanent traceability — without overseas lead times.
Why Choose a U.S.–Based Partner
- Manufactured in Maryland: All work is completed at our facility in Baltimore County — ensuring fast, domestic turnaround.
- Secure and Confidential: Your designs and customer data stay within the United States at all times.
- Compliant with U.S. Standards: We support DFARS sourcing, ITAR-sensitive handling, and U.S. export-controlled processes.
- Engineering-Driven Collaboration: Direct communication with our Maryland engineers for parameter tuning, sample approval, and QA validation.
- Supporting American Manufacturing: Every project helps strengthen the U.S. advanced manufacturing ecosystem.
Our Core Services
- Precision Laser Marking
- Serial numbers, QR codes, and data matrix codes
- Compliance marks (UL, CE, RoHS, UDI, etc.)
- Permanent branding, logos, and microtext
- Anti-counterfeit traceability and product IDs
Industries We Serve
- Medical Devices: Sterilization-resistant, UDI-compliant identification.
- Electronics & Semiconductors: Fine-scale wafer and interposer marking.
- Aerospace & Defense: DFARS and domestic-sourcing compliant marking solutions.
- Industrial Components: Rugged, permanent codes for traceability and warranty tracking.
Our Commitment to American Innovation
-
Heisler Semiconductor LLC is a U.S.–owned small business dedicated to advancing domestic electronics manufacturing.
From prototypes to production, we combine precision laser technology with advanced materials knowledge to deliver repeatable, high-quality marking — right here in the United States.
Materials We Process
Plastics
- Polyimide (Kapton)
- Polycarbonate
- PEEK
- LDPE
- HDPE
- Silicone
- ABS
- Nylon
- BoPET (Mylar)
Metals
- Stainless Steel
- Copper
- Brass
- Tantalum
- Titanium
- Aluminum
- Kovar
Electronics
- Semiconductors
- Glass
- Ceramics
- components
- PCBs
Micro Hole Drilling
Heisler Semiconductor LLC provides micro hole drilling services, delivering high-precision, laser-drilled features for applications such as micro vias, fluidic channels, and specialty apertures in advanced materials.
Micro Machining
Heisler Semiconductor LLC provides laser micro-machining services utilizing high-precision laser systems as micro-scale CNC tools for custom etching and structuring of advanced materials.
Laser Patterning
Heisler Semiconductor LLC offers laser patterning services for direct-write fabrication of micro-scale features, enabling rapid prototyping and custom patterning of metals, polymers, and other advanced materials.
Laser Marking
Heisler Semiconductor LLC provides laser marking services for traceability applications, including serial numbers, QR codes, and compliance markings on semiconductor and electronic components.
Laser Cutting
Heisler Semiconductor LLC offers laser cutting services for precise depanelization of PCBs, stencil fabrication, and high-accuracy cutting of thin and delicate materials.
Laser Etched Promotional Products
Heisler Semiconductor LLC offers custom laser engraving for promotional products such as tumblers, drinkware, and other branded merchandise. Our engraving process creates permanent, professional-quality marks ideal for logos, corporate gifts, event giveaways, and personalized items. We provide fast turnaround, consistent quality, and flexible order sizes—ranging from small custom runs to large-scale bulk orders. This service helps businesses, schools, and organizations showcase their brand with durable, eye-catching products that stand out.
Laser Processing in Semiconductor Manufacturing
In the semiconductor industry, laser processing is a cornerstone for advanced manufacturing processes, enabling high precision and efficiency. Key applications include:
Wafer Dicing
Lasers are used to cut semiconductor wafers into individual chips with minimal kerf loss and reduced mechanical stress compared to traditional methods.
Drilling Through-Semiconductor-Vias (TSVs)
Laser drilling creates precise, high-aspect-ratio vias for vertical electrical interconnects in 3D stacked chips.
Surface Patterning
Lasers enable the creation of intricate patterns for photonic and electronic applications, including micro-optics and sensors.
Thin Film Removal
Selective ablation of thin films ensures clean, damage-free processing for applications like photovoltaics and MEMS.
Advanced Packaging
Laser marking on interposers and semiconductor packages ensures traceability and alignment for assembly.