Advanced Packaging / Wire Bond
Wire bonds that pass screening.
Gold ball and aluminum wedge interconnect — from fine-pitch die-to-substrate to heavy aluminum power loops. Bond programs developed with pull and shear verification, qualified to the standards your hardware ships under.
/ Au ball · Al wedge / fluxless / MIL-STD when required / US-soil
Proof, from real builds
Gold, aluminum, copper wire — ball & wedge bond
Lead-frame, substrate, PCB, die-to-die
Wafer formats handled · die-to-substrate, PCB & lead-frame
Pull/shear distributions, bond schedules, and qualification data available under NDA.
Capability
Ball, wedge, and everything between.
One bonding cell, both metallurgies. We match the bond — gold thermosonic ball or aluminum ultrasonic wedge — to the pad, the pitch, the current, and the reliability target, not to whatever the shop happens to run.
Fine-pitch signal routing and heavy-wire power loops come off the same engineering team that develops the program and signs off the data.
- 01Gold ball bonding — thermosonic, fine-pitch signal interconnect for die-to-substrate and die-to-die.
- 02Aluminum wedge bonding — ultrasonic, low-temperature, ideal for temperature-sensitive and Al-pad devices.
- 03Heavy aluminum wire — high-current power loops for module and power-device interconnect.
- 04Fine-pitch routing — tight pad arrays where loop control and placement decide the yield.
- 05Fluxless interconnect — clean assembly with no post-attach residue to remove.
- 06Substrate flexibility — die to substrate, PCB, lead-frame, AlN, and ceramic carriers.
Au + Al on one platform · signal to power · 2″–12″ wafers · die-to-substrate / PCB / lead-frame.
Process control
A bond is data, not a guess.
Program development
Force, ultrasonic energy, time, and temperature dialed in per device — then locked as a documented schedule.
Loop control
Loop height and profile managed for clearance, span, and reliability — no shorts, no strain at the heel.
Pull & shear
Destructive pull and ball-shear testing to MIL-STD-883 methods, with failure-mode capture, not just a pass count.
DOE-driven
New devices run through structured DOE so the process window is found by data, not by re-bonding until it sticks. See how we develop →
Every adjustment stays traceable and tied to the pull/shear distribution it produced.
Qualification & reliability
Built to survive the screen.
A bond that looks good and a bond that survives 1,000 thermal cycles are different bonds. We develop to the second one. Screening and environmental stress are part of the build, not an afterthought handed to someone else.
MIL-STD screening
Wire-bond pull and shear per MIL-STD-883; visual and mechanical screening to program requirements.
Thermal cycling
Temperature-cycle stress to expose heel cracking and intermetallic weakness before flight, not after.
Hermetic & environmental
Bonding compatible with hermetic packaging and environmental qualification flows.
Traceable data
Per-lot bond data and screening results documented for your qualification package.
Full screening flows and reliability data → Failure analysis & reliability
Choosing the interconnect
Wire bond or flip chip?
Both run under one roof, so the recommendation is honest. Here is when wire bond is the right call — and when it isn't.
- →Lower volumes, fast turns, and design changes still in motion.
- →Peripheral I/O counts where re-routing to an array adds no value.
- →High-current power loops that want heavy aluminum wire.
- →Mature, well-understood reliability with broad MIL-STD precedent.
- →High I/O counts that need area-array, not a perimeter ring.
- →RF and mmWave paths where loop inductance hurts the signal.
- →Tight z-height budgets and dense multi-chip integration.
- →See flip-chip capability →
Not sure which fits your device? That is a design-review conversation — part of our advanced packaging engagement.
Where these bonds ship.
Aerospace & Defense
MIL-STD-qualified interconnect for flight and mission hardware. A&D packaging →
RF & mmWave
Short, controlled loops where bond geometry is part of the electrical design.
Medical & Bio
Clean, fluxless assembly for sensitive sensor and instrument devices.
Advanced Sensors
Fine-pitch die-to-substrate routing for MEMS and detector packages.
How we engage
From your pads to qualified hardware.
One US-based engineering team owns the bond program from first article through screened delivery.
Process More.
Send us the pad map.
We’ll send back bonds that screen clean.
Request a capability brief for bond schedules, pull/shear distributions, and qualification data under NDA.
/ US-soil / ITAR-aware / MIL-STD