A Data Service From Heisler Semiconductor
Send Your Inspection Data.
Get Back Known-Good Die.
Ship us your inspection images and wafer maps. We return per-die defect classification and a traceable record for every die — automated, data-driven, with an engineer in the loop. No fab, no packaging line, no hardware purchase required.
01 How It Works
Pure data in, records out.
01 · Data In
You send the data
Inspection images, wafer maps, or AOI output. US-soil, ITAR-aware, confidential.
→ 02 · Classify
Automated classification
An ML classification engine flags and categorizes defects, die by die.
→ 03 · Review
Engineer in the loop
A Heisler process engineer reviews and confirms the calls before anything returns.
→ 04 · Records Out
Traceable records
Per-die classification and a documented disposition for every die — in a format that feeds your screening flow.
02 For Rad-Hard & Defense
Per-Die Disposition · Schematic
Traceability is a data problem before it's a packaging problem.
Rad-hard and space programs have to account for every die. We turn your inspection images and wafer maps into a per-die traceability record — defect classification plus a documented disposition for every die on the map — on US soil, ITAR-aware, with an engineer signing off the calls. Works whether or not you package with us.
The software a packaging shop can't claim
Our edge is the engineering and the classification software wrapped around the process — not a service menu.
Capital-light by design
Partner facilities run the line; this service needs no fab at all. You pay for the data work, not for capacity.
Engineer-backed, available today
Automated where it should be, human where it matters — a process engineer signs off every disposition.
Process More.
Send a sample wafer map. See your die come back classified and traceable.
Start a Data Service Brief
sales@heislersemiconductor.com
heislersemiconductor.com
1014 W 36th St, Baltimore, MD 21211