Inspection / Reliability
Find the failure.
Qualify the build.
Failure analysis and reliability qualification, run by the same engineers who develop the process. We tell you why a part failed – and prove the ones that pass.
/ X-ray · SEM · cross-section / MIL-STD when required / ITAR-aware / US-soil
Proof, from real builds
Yield on 50 aviation interposers · inspected and verified, build to read-out
Bumps in a single flip-chip package · cross-sectioned and confirmed · 100% yield
MEMS assemblies · panel-level · 100% yield with full inspection coverage
Detailed failure-analysis reports, cross-section imagery, and reliability data available under NDA.
Failure analysis
See inside the part before you open it.
Failure analysis is a sequence, not a single tool. We start non-destructive, preserve the evidence, then escalate to cross-section and SEM only when the answer demands it.
Every read-out is tied to a coordinate on the part, so a void, a crack, or an intermetallic isn't just observed – it's located, measured, and traced back to the process step that made it.
- 01X-ray (Creative Electron) – non-destructive void, bond-line, and wire-sweep inspection on assembled parts
- 02SEM – high-magnification imaging of cracks, delamination, and fracture surfaces
- 03Mechanical cross-section – interface, intermetallic, and joint-integrity review at the bond line
- 043D AOI – automated optical inspection for coplanarity, placement, and surface defects
- 05Sub-micron metrology (Keyence) – dimensional measurement and 3D profiling down to the micron
Non-destructive first · evidence preserved · destructive read-out only when it answers the question.
Reliability & qualification
Stress it on purpose. Pass it on record.
01 / Thermal
Thermal cycling
Temperature extremes drive out joint, underfill, and CTE-mismatch failures before the field does.
02 / Screen
Environmental screening
Burn-in and stress screening to weed out infant-mortality defects on production-intent builds.
03 / Seal
Hermetic test
Fine and gross leak test on sealed and hermetic packages to confirm the cavity stays sealed.
04 / Standard
MIL-STD qualification
Qualification flows built to the standard the program requires, US-soil and ITAR-aware.
Stress conditions defined to the application – then read out with the same inspection and metrology toolset used during the build.
A finding on the bench
changes the process.
Most shops hand you a failure report and stop. We close the loop.
Because the same engineering team owns both the build and the analysis, every void, crack, or leak becomes a data point that tightens the process window. Failure analysis feeds the data-driven process control behind our engineering & AI work – so the next build doesn't repeat the last one's failure mode.
That is the difference between a part that passed once and a process that passes every time.
The loop
Where this matters most
Hardware that cannot fail in the field.
Aerospace & Defense
Qualified to the mission
MIL-STD flows, hermetic confirmation, and traceable failure analysis for hardware that has to survive launch, altitude, and temperature – built and proven on US soil. See aerospace & defense packaging.
Medical & Bio
Sealed, screened, documented
Implantable and diagnostic devices need hermetic packaging that stays sealed for the life of the part – verified with leak test, cross-section, and a documented reliability record.
How we engage
Send us the part. Or the question.
One team, build through qualification.
Pair this with our inspection & metrology capability and you have a single engineering team that can both build the hardware and prove it – without shipping your part to three vendors and losing the thread between them.
Process More.
Have a part that failed?
Or one you need to prove?
Request a capability brief for failure-analysis methods, reliability flows, and build data under NDA. We'll tell you what we can read out – and how fast.
/ US-soil / ITAR-aware / MIL-STD