Inspection & Metrology
Inspection as an engineering tool.
Non-destructive X-ray, 3D AOI, high-mag optical, and sub-micron metrology — run as active engineering instruments, not a pass/fail gate at the end of the line. The same data feeds our process-control loop.
/ Non-destructive / Sub-micron / Data-correlated / US-soil
What we do
Five ways we see inside the part.
Every measurement is tied back to a process parameter. We inspect to learn, not just to sort.
- 01Non-destructive X-ray — solder-joint integrity, voiding, head-in-pillow, and hidden interconnect on BGA, flip-chip, and stacked die. Creative Electron systems.
- 023D AOI — placement, coplanarity, standoff, and geometry verification across the panel, board, and module level.
- 03High-magnification optical — bond geometry, die placement, edge and surface condition, with image stitching for full-field views. Keyence VHX.
- 04Dimensional & surface metrology — sub-micron measurement, 3D profiling, and overlay verification on die, bumps, and traces.
- 05Advanced characterization & failure analysis — SEM imaging and cross-sectioning to confirm root cause and close the loop on a process change.
Why it matters
Measurement that moves the process.
Inspection data is only useful if it changes what you do next. We correlate it with process parameters and yield so drift gets caught early — before it shows up at final test.
Verify die placement, bond geometry, and overlay against the design intent. Trend the numbers build-over-build. Tie a defect mode back to the recipe that caused it. The output is a faster path to a stable process window, with the evidence to back every adjustment. This is the data engine behind our AI-assisted process control — see Engineering & AI for how that loop closes.
Measured capability
Dimensional & surface metrology resolution · 3D profiling with image stitching
Full detail under NDA.
How we engage
From first article to production-intent.
We bring inspection in at the development stage, not after the fact.
First-article verification, in-process checks tied to control points, and full characterization when something needs a root cause. Reports, image sets, and metrology data are delivered build-by-build. Detailed inspection criteria, measurement methods, and failure-analysis findings are available under NDA.
Process More.
Bring us the part you
can't see inside of.
One team, design review through volume. Request a capability brief for inspection criteria, metrology methods, and build data under NDA.
/ US-soil / ITAR-aware / MIL-STD