What is software-hardware co-design?

The same engineering team develops the firmware and the hardware against each other. The people who lay out the board also write the bring-up code and the bench test routines, and packaging and inspection are in the loop from the first revision so manufacturability is a design input rather than a scale-up surprise.

Can you take a product from concept all the way to a volume launch?

Yes. We carry a product from concept and feasibility through circuit, device and hardware design, firmware and bring-up, prototypes and test vehicles, packaging and assembly, low-volume production-intent builds, and process transfer to scale-up. One US-based engineering team owns the path from block diagram to a volume-qualified launch.

Can you join a program that is already in progress?

Yes. You can start anywhere in the lifecycle: feasibility, a prototype or test vehicle, an iterative R&D program, a low-volume production-intent build, or process transfer and scale-up. Scope, deliverables, and decision gates are defined per program under NDA.

Is the work done in the United States?

Yes. Design, firmware, packaging, and test are performed on US soil with an ITAR-aware process, and MIL-STD qualification is available when a program requires it.

Product Realization / NPI

Concept to launched product. One team.

Most partners pick up a finished design and assemble it. We start at the block diagram and carry your product through design, firmware, packaging, and a volume-qualified launch — one engineering team, on US soil.

Request a capability brief Talk to sales

/ Concept to volume / Software + hardware co-design / MIL-STD when required / US-soil

RF eval boards / hardware the team designs

We take the whole product, not one step.

A finished product is the goal — not a bonded die handed back without context. We own the path from the first feasibility question to a build that ships at volume.

01Concept & feasibility
02Circuit, device & hardware design — designed to be packaged
03Firmware & bring-up — embedded control plus bench routines that prove the hardware
04Prototype & test vehicles
05Packaging & assembly — die attach, wire bond, flip chip, hermetic, 3D
06Low-volume, production-intent builds
07Process transfer & scale-up

Design rules, firmware architecture, and step-level routing available under NDA.

Software + Hardware Co-design

The people who write the firmware draw the board.

Firmware and hardware are developed against each other, not over a wall. The same team lays out the board, writes the bring-up code, and writes the test routines that prove it works.

Packaging and inspection sit in the loop from the first revision, so manufacturability is a design input — not a problem you discover at scale-up. The result is a part where the silicon, the package, the firmware, and the test bench were planned together. This is where design & firmware meets advanced packaging.

We design the software and build the hardware. Most packaging shops do neither.

Why it matters

Fewer handoffs. Fewer respins. Faster to qualified hardware.

Fewer handoffs. Fewer respins. A part that reaches qualified hardware faster.

Every gate between concept and volume is an opportunity to lose context. We close those gaps by keeping ownership in one place, backed by data at every step. See how we do that in engineering & AI.

01One owner from concept to volume
02Manufacturability designed in, not discovered at scale-up
03DOE- and SPC-backed development
04Engineering sign-off and traceability at every gate

How we engage

Start anywhere in the lifecycle.

You do not have to hand us a clean sheet. Bring a concept, a half-finished prototype, or a working part that will not scale — we pick up the program where it stands.

Mid-program engagements often start with a build that needs a stable, US-soil path to volume — including supply-chain and process transfer.

01Feasibility
02Prototype & test vehicle
03Iterative R&D program
04Low-volume production-intent build
05Process transfer & scale-up

Scope, deliverables, and decision gates defined per program under NDA.

What you can count on

One team

Design, firmware, packaging & test under one roof

US-soil

Domestic, ITAR-aware, MIL-STD when required

DOE + SPC

Data-driven development, fewer iterations

Full design rules, firmware architecture, and build data available under NDA.

Process More.

Bring us the product that isn't built yet.

One team, concept to launch — design, firmware, packaging, and a volume-qualified build. Request a capability brief for design rules, firmware architecture, and build data under NDA.

Request a Capability Brief

/ US-soil / ITAR-aware / MIL-STD