Industries / Medical & Bio
Medical builds that hold up.
Hermetic, biocompatible, sensor-grade assembly for implantable, diagnostic, and lab-on-chip hardware – developed and qualified by one engineering team, on US soil.
/ Hermetic seal & test / Biocompatible substrates / Panel-level yield / US-soil
What medical hardware demands
The part has to survive the body.
An implantable sensor or a diagnostic die fails differently than a phone chip. Moisture, ions, thermal cycling, and a decade of duty cycles all attack the package, not the silicon.
We build to those constraints from the first test vehicle: a verified hermetic boundary, materials that the body and the regulators accept, and a placement process tight enough to hold MEMS and sensor yield at panel scale. Process development, assembly, and inspection sit under one roof, so a problem found at metrology gets fixed in the recipe – not handed to another vendor.
01
MEMS & sensor assembly
Fragile MEMS, biosensors, and microfluidic die placed at ±2.5µm @3σ – panel-level for diagnostic and wearable volumes.
02
Hermetic sealing
Sealed cavities and hermetic boundaries for implantable and long-life devices, with hermetic test built into the flow.
03
Biocompatible substrates
Sapphire, quartz, AlN, polyimide, and thin-film metallization processed for biocompatible, CMOS-compatible builds.
04
Panel-level scale
The same process that proves out on a coupon scales to panel-level production without re-developing the window.
Capabilities behind the build
One stack, cradle to qualification.
A medical program rarely needs one process. It needs die attach, a sealed cavity, a wafer-level front end, and the inspection data to prove all of it – coordinated by people who own every step.
Pick the capability your device leans on; each is a full pillar you can dig into.
- 01Advanced packaging – die attach, wire bond, and 3D heterogeneous integration of sensing die with readout and RF in one package.
- 02Flip chip – C4/C2 and Au-stud attach for MEMS, sensor, and stacked-die modules at ±2.5µm @3σ.
- 03Hermetic packaging – sealed cavities, lids, and a verified moisture boundary for implantable and long-life hardware.
- 04Wafer-level processing – litho, TSV, deposition, etch, and RDL for sensor front ends and interposers, 2″–12″.
- 05Inspection & metrology – X-ray, 3D AOI, SEM, and cross-section that generate the traceable data record.
Materials: Si (CMOS-compatible) · sapphire · quartz · AlN · polyimide · underfills · thin-film metallization.
Proof, from real builds
MEMS assemblies · panel-level · 100% yield · no post-attach clean
Yield across those panel-level MEMS builds – repeatable, documented
Placement accuracy @3σ – BESI Datacon & Tresky die attach
Full process detail, materials data, and reliability results available under NDA.
Yield at scale is a reliability claim.
100% across 4,000+ panel-level MEMS assemblies is not a marketing number – it is evidence that the process window is stable and the failure modes are understood.
For a medical device, that matters twice: it protects your build cost, and it is the kind of repeatability your quality system has to demonstrate. We treat yield, hermeticity, and placement as data to be controlled, not outcomes to be hoped for – which is what lets a process move from a sensor prototype to qualified production without starting over.
Quality & traceability
A record for every unit.
Medical programs live or die on documentation. We run SPC-controlled processes and capture inspection, metrology, and test data on every build, so the evidence exists when your quality team or an auditor asks for it.
We support MIL-STD qualification and hermetic test, and structure documentation and change control to slot into a regulated device program. We do not certify your device – we give your DHF the process data and traceability it needs.
- 01SPC-controlled process windows with documented limits
- 02Per-build inspection, metrology & test data capture
- 03Hermetic test and thermal-cycle screening on request
- 04MIL-STD qualification flows when the program requires
- 05Structured change control and process-transfer packages
How we engage
Start with the hard part.
Bring the requirement that worries you – the seal that has to stay hermetic, the MEMS die that cracks, the substrate nobody else will touch. We scope it under NDA, build a test vehicle, and prove the window before you commit to volume. Specific customer work stays confidential, always.
Common questions
Before you send the RFQ.
Can you build hermetic packages for implantable devices?
Yes. We build sealed cavities and hermetic boundaries for implantable and long-life hardware, with hermetic test built into the assembly flow. Seal design and qualification detail are shared under NDA.
What materials do you process for biocompatible builds?
Silicon (CMOS-compatible), sapphire, quartz, AlN, and polyimide, plus underfills and thin-film metallization. We match substrate and bonding materials to the device’s biocompatibility and reliability requirements.
Do you handle MEMS and sensor die at production volume?
Yes. We have run 4,000+ MEMS assemblies panel-level at 100% yield, placed at ±2.5µm @3σ. The process that proves out on a coupon scales to panel-level without re-developing the window.
Can you support our regulated device documentation?
We run SPC-controlled processes and capture per-build inspection, metrology, and test data, plus MIL-STD qualification and hermetic test on request. We provide the process data and traceability your design history file needs; device certification stays with you.
Where is the work done?
On US soil, by one engineering team that owns design review through volume. Specific customer programs are confidential.
Process More.
Build medical hardware
that holds up.
One team, design review through qualified volume, on US soil. Request a capability brief for hermetic, biocompatible, and MEMS process detail under NDA.
/ Hermetic / Biocompatible / US-soil