Jake Heisler What Is an OSAT, and When Does a US One Make Sense? OSAT stands for Outsourced Semiconductor Assembly and Test. A fab makes die; an OSAT turns those die into packaged, tested parts you can put on a board. The model exists because assembly and test are ... Advanced Packaging Die Attach Sep 22, 2026
Jake Heisler What Is a Hermetic Package? Leak Rates, Materials, and When You Need One A hermetic package is a sealed cavity that keeps the outside atmosphere away from the die inside it, to a leak rate you can qualify and put on a drawing. The word sounds binary — sealed or not — but i... Advanced Packaging Hermetic Packaging Sep 21, 2026
Jake Heisler Eutectic Die Bonding: AuSn, AuSi, and What the Process Actually Requires Eutectic die bonding attaches a die to its substrate with a metallurgical joint — no polymer, no filler — formed by melting a eutectic alloy at a single, sharply defined temperature. A eutectic alloy ... Advanced Packaging Die Attach Sep 21, 2026
Jake Heisler Epoxy Die Attach Process: Dispense, Place, Cure, and What Goes Wrong Epoxy die attach is three steps — dispense the adhesive, place the die, cure the joint — and it is the lower-temperature, more forgiving, lower-cost way to attach a die when the part does not need a m... Die Attach Process Insight Sep 21, 2026
Jake Heisler Gold Wire Bonding: Why Au, Which Diameter, and When Aluminum Wins Gold wire bonding attaches a fine gold wire from a die pad to a package lead using a thermosonic ball bond — heat plus ultrasonic energy, with nothing melting. Gold gets used because it does not oxidi... Advanced Packaging Wire Bonding Sep 21, 2026
Jake Heisler Aluminum Wedge Bonding and Thermocompression: The Two Bonds That Aren't Thermosonic Three wire-bond regimes are in common use, and they differ in exactly one thing: what supplies the energy that welds the wire to the pad. Thermosonic — heat plus ultrasonic scrub — is the one most gol... Advanced Packaging Wire Bonding Sep 21, 2026
Jake Heisler Die Shear Testing: What MIL-STD-883 Method 2019 Actually Verifies A die shear test pushes sideways on an attached die until it separates from the substrate, and records the force it took. That force is the direct measurement of die-attach strength, and MIL-STD-883 M... Die Attach Failure Analysis Sep 21, 2026
Jake Heisler Die Sorting and Inspection as a Service: What Gets Checked and What Gets Logged Die sorting and inspection as a service does two things: it separates good die from bad, and it produces a structured record of why each die was called what it was called. The first is table stakes — ... Capability Inspection Sep 21, 2026
Jake Heisler Wire Bonding Service: What to Send, What Comes Back If you have bare die and need them wire bonded to a substrate or package, the two useful questions are what to send and what comes back. This is the checklist version. Send these five things and a wir... Capability Wire Bonding Sep 21, 2026
Jake Heisler I've Been Packaging Semiconductors Since I Was 12 That's me at 12, back in 2007. Learning saw dicing, die bonding and wire bonding in a cleanroom. Me at 12, in 2007. Engineering assistant — dice, die bond, wire bond, inspect. I've been packaging semi... Company News Industry Insight Sep 20, 2026
Jake Heisler Copper Pillar Flip Chip: When Standoff Has to Be Controlled A copper pillar bump — C2 — replaces the C4 solder ball with a plated copper post carrying a small solder cap. The post does not melt at reflow, so the gap between die and substrate is set by the heig... Advanced Packaging Flip Chip Sep 5, 2026
Jake Heisler Thermosonic Wire Bonding: What It Is, and Who Does It as a Service in the US Thermosonic wire bonding is a solid-state welding process that attaches a fine wire — almost always gold — to a bond pad using ultrasonic energy and heat together, with the part held at roughly 150 °C... Advanced Packaging Wire Bonding Aug 29, 2026
