Heisler Insights

Taking advanced electronics from idea to a manufacturable product — the manufacturing calls that make or break it.

C4 vs Copper Pillar: Choosing the Flip-Chip Bump

C4 vs Copper Pillar: Choosing the Flip-Chip Bump

Most teams do not choose a flip-chip bump. They inherit one, because the substrate vendor quotes what their line already runs and the package quietly forms around that decision. That is fine until pit...

Advanced Packaging Flip Chip Process Insight

Jul 27, 2026

Flip Chip on Maskless AlN: Controlling Solder With the Profile, Not a Dam

A solder mask does one quietly important job at reflow: it walls the molten alloy in. Take it away and every joint wants to misbehave — bridge to its neighbour, pull off-pad, or starve while the alloy...

Flip Chip Process Insight RF Packaging

Jul 27, 2026

Wire Bond Types: Ball vs Wedge, Gold vs Aluminum

Heisler Semiconductor LLC, Tathansh Joshi

Wire Bond Types: Ball vs Wedge, Gold vs Aluminum

Ask what type of wire bond a part needs and you get two questions, not one: how the weld is made, and what the wire is made of. Ball or wedge sets the geometry and the tooling. Gold or aluminum sets t...

Process Insight Wire Bonding

Jul 12, 2026

Wire Bonding vs Flip Chip: When to Use Which

Heisler Semiconductor LLC, Omkar Gaikwad

Wire Bonding vs Flip Chip: When to Use Which

The honest answer to wire bond or flip chip is rarely about which one is more advanced. Both are mature, both ship in high-reliability hardware, and neither is a trophy. The real question is what the ...

Advanced Packaging Flip Chip

Jul 12, 2026

Wire Bond Pull Testing: What MIL-STD-883 Method 2011 Actually Verifies

Wire Bond Pull Testing: What MIL-STD-883 Method 2011 Actually Verifies

Every wire bond that ships into an aerospace, defense, or medical program has to answer a blunt question: how do you know it will hold? For wire bonding, the standard answer is MIL-STD-883 Method 2011...

Jul 2, 2026

Wire Bond vs Flip Chip: How to Choose the Right Interconnect

Wire Bond vs Flip Chip: How to Choose the Right Interconnect

Every packaged die answers one question first: how does the chip connect to the outside world? Wire bond and flip chip are the two workhorse answers, and the choice ripples through footprint, electric...

Jul 2, 2026

Outsourcing Semiconductor Packaging: Do You Need Your Own Fab?

Outsourcing Semiconductor Packaging: Do You Need Your Own Fab?

There's a moment in most hardware programs where the prototype works, the market is asking for units, and someone in the room says: we need our own line. It feels like the responsible move. For most a...

Jul 2, 2026

Advanced Electronics Manufacturing: From Prototype to Production

Advanced Electronics Manufacturing: From Prototype to Production

Most advanced-electronics programs don't fail because the idea was wrong. They fail in the gap between a working prototype and a product you can build again — the same way, at volume, with data behind...

Jul 2, 2026

The Next Generation of Manager Wields the Toolkit

The Next Generation of Manager Wields the Toolkit

The next generation of great managers will not be defined by headcount or title. They will be defined by how well they wield the tools. Claude Code, Gemini CLI, Codex these are now part of the working...

Company News Process Insight

Jun 16, 2026

Plating Thickness vs Pull Strength: The Correlation Nobody Logs

Heisler Semiconductor LLC, Tathansh Joshi

Plating Thickness vs Pull Strength: The Correlation Nobody Logs

When wire-bond pull strength comes in low, the instinct is to tune the bonder. More often, the ceiling was set weeks earlier in the plating specification, not at the bonder. Force, ultrasonic energy, ...

Process Insight Wire Bonding

Jun 16, 2026

When Your Assembly House Isn't Your Test House

Heisler Semiconductor LLC, Omkar Gaikwad

When Your Assembly House Isn't Your Test House

The day your assembly house and your test house are two different vendors, you have added a coordination problem to the program whether you planned for it or not. Splitting assembly and test across be...

Multi-Vendor Process Insight

Jun 11, 2026

Field Notes from IMS 2026

Field Notes from IMS 2026

IMS 2026 ran last week in Boston. The most consistent theme across the floor wasnt the die it was the package. Specifically, how much of the engineering that determines whether an RF or microwave syst...

Industry Insight RF Packaging

Jun 10, 2026

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