Jake Heisler Epoxy Die Attach Process: Dispense, Place, Cure, and What Goes Wrong Epoxy die attach is three steps — dispense the adhesive, place the die, cure the joint — and it is the lower-temperature, more forgiving, lower-cost way to attach a die when the part does not need a m... Die Attach Process Insight Sep 21, 2026
Jake Heisler C4 Bump Pitch: What Sets the Limit C4 bump pitch has a floor because a molten solder ball spreads as it collapses during reflow — a fixed volume of metal that has to clear its neighbors without bridging. There's no single number: the l... Advanced Packaging Flip Chip Process Insight Aug 5, 2026
Jake Heisler What Is a C4 Bump? Solder Bump Basics for Flip Chip C4 — Controlled Collapse Chip Connection — is a flip-chip interconnect made from solder balls that melt during reflow and self-align the die by surface tension as the molten metal collapses into place... Advanced Packaging Flip Chip Process Insight Aug 5, 2026
Jake Heisler C4 vs Copper Pillar: Choosing the Flip-Chip Bump Most teams do not choose a flip-chip bump. They inherit one, because the substrate vendor quotes what their line already runs and the package quietly forms around that decision. That is fine until pit... Advanced Packaging Flip Chip Process Insight Jul 27, 2026
Jake Heisler Flip Chip on Maskless AlN: Controlling Solder With the Profile, Not a Dam A solder mask does one quietly important job at reflow: it walls the molten alloy in. Take it away and every joint wants to misbehave — bridge to its neighbour, pull off-pad, or starve while the alloy... Flip Chip Process Insight RF Packaging Jul 27, 2026
Heisler Semiconductor LLC, Tathansh Joshi Wire Bond Types: Ball vs Wedge, Gold vs Aluminum Ask what type of wire bond a part needs and you get two questions, not one: how the weld is made, and what the wire is made of. Ball or wedge sets the geometry and the tooling. Gold or aluminum sets t... Process Insight Wire Bonding Jul 12, 2026
Jake Heisler The Next Generation of Manager Wields the Toolkit The next generation of great managers will not be defined by headcount or title. They will be defined by how well they wield the tools. Claude Code, Gemini CLI, Codex these are now part of the working... Company News Process Insight Jun 16, 2026
Heisler Semiconductor LLC, Tathansh Joshi Plating Thickness vs Pull Strength: The Correlation Nobody Logs When wire-bond pull strength comes in low, the instinct is to tune the bonder. More often, the ceiling was set weeks earlier in the plating specification, not at the bonder. Force, ultrasonic energy, ... Process Insight Wire Bonding Jun 16, 2026
Heisler Semiconductor LLC, Omkar Gaikwad When Your Assembly House Isn't Your Test House The day your assembly house and your test house are two different vendors, you have added a coordination problem to the program whether you planned for it or not. Splitting assembly and test across be... Multi-Vendor Process Insight Jun 11, 2026
Heisler Semiconductor LLC, Tathansh Joshi Die Attach: Solder vs Epoxy vs Sinter, and Why CTE Drives the Choice Die attach is not a one-material decision. Solder, epoxy, and sintered materials each accommodate CTE mismatch differently and the choice made at attach is what thermal cycling will expose, hundreds o... Die Attach Process Insight May 26, 2026
Heisler Semiconductor LLC, Tathansh Joshi Wire-Bond Pull Strength: What 8g vs 12g Actually Predicts MIL-STD-883 Method 2011 sets the minimum pull strength for 25µm gold wire at 3 grams. An 8g population and a 12g population both pass. They do not predict the same things and treating them as equivale... Process Insight Wire Bonding May 20, 2026
Jake Heisler The University-to-Fab Gap Nobody Is Funding Federal money built the fabs. State programs fund the university research. Almost nothing funds the layer in between the process work that turns a published result into a part a customer can buy. The ... Lab-to-Fab Process Insight May 14, 2026
