About Heisler Semiconductor
Heisler Semiconductor designs and builds advanced semiconductor packages and test hardware for companies and research groups developing RF, mmWave, power, MEMS and sensor devices, out of a lab in Baltimore, MD and a production site in York, PA. We take work from design through assembly and characterization, and our build volume is climbing from prototype lots toward production.
Location: Baltimore, MD (bwtech@UMBC) · Full-time · Split between our Baltimore lab and our production site in York, PA
The role
You'll own how our parts get built. You'll run and improve our assembly processes, keep production lots on track, and help build out new tools and capabilities in the lab. You'll work directly with the founder and our engineering team.
What you'll do
- Run and develop assembly processes: dicing, die attach, wire bonding, encapsulation and inspection.
- Write and maintain process travelers, work instructions and inspection criteria.
- Track yield and defects, run root-cause investigations and close them out.
- Do electrical test and characterization on built parts.
- Oversee production lots from kitting through shipment.
- Help bring up new equipment and processes in the lab.
What you need
- BS in Electrical, Materials, Mechanical or Chemical Engineering, or a related field.
- Hands-on time in a cleanroom, fab, assembly line or electronics lab.
- Comfort with data: spreadsheets, Python or a stats tool for yield and process data.
- Careful documentation habits.
Nice to have
- Wire bonding, die attach, dicing, laser processing or thin-film experience.
- SPC, DOE or root-cause methods (8D, fishbone).
- Microscopy, X-ray or other failure analysis.
How to apply
Apply through this page with your resume and a short note on a process you improved or a build problem you solved.
Heisler Semiconductor is an equal opportunity employer.
