Engineering / Design & Firmware
Design through
to volume.
Circuit, device, and hardware design. Firmware. RF evaluation boards and test vehicles. The same engineering team carries the part from schematic through packaging and volume build — so the people who draw it are the people who qualify it.
/ Design-to-volume / ITAR-aware / MIL-STD when required / US-soil
Most partners start at
assembly. We start earlier.
A packaging vendor that only receives a finished design inherits every decision that already locked in cost and risk. We sit upstream of that handoff.
Bring us a block diagram, a target spec, or a die that needs a home, and we will design the circuit, the device, the board, and the firmware around it — with packaging and inspection in the room from the first revision. The result is a part where manufacturability was a design input, not a post-mortem.
Design capability
What we design. What we write.
Six disciplines, one team. Each one feeds the next, and all of them feed the build floor downstairs.
We design to be packaged. Pad pitch, layer stack, thermal path, and test access are set with the bonder, the laser, and the X-ray in mind — not as an afterthought handed to a separate shop.
- 01Circuit design — schematic capture, analog and digital signal paths, power and bias.
- 02Device design — die-level and component architecture matched to the package and the process window.
- 03Hardware design — board layout, stack-up, interconnect, and signal integrity for the target environment.
- 04Firmware — embedded control, bring-up, and the test routines that exercise the hardware on the bench.
- 05RF evaluation boards — characterization vehicles for high-frequency parts, on materials we also package on.
- 06Test vehicles — structures that prove the hard part of the process before it ships into a real build.
Design rules, stack-up detail, and firmware architecture available under NDA.
Why design-to-volume under one roof
Fewer handoffs. Fewer respins.
Every handoff between a design house, a board shop, and a packaging vendor is a place to lose a revision. We collapse those handoffs into one engineering team.
When the same people own design intent, layout, and the build floor, a packaging constraint becomes a design change in the same week — not a returned lot and a new purchase order. Iterations that would normally span three vendors and three schedules happen in one. That is how a new part reaches qualified hardware faster, and with the data to back every decision.
It is the same discipline we apply to process development on our Engineering & AI work — DOE, SPC, and data-driven control — pulled forward to the design stage so risk is retired before scale-up, not after.
No re-explaining the part to a new vendor at each step.
Design hands off to the floor.
A finished design only matters if someone can build it. The same team that designed the part packages it — here are the lines it lands on.
From design to qualified hardware
Yield on 10+ RF boards · fluxless, maskless on AlN
Bumps in a single flip-chip package · designed, built, 100% yield
MEMS assemblies · panel-level · 100% yield
AI-assisted iteration pulled forward to the design stage means fewer trial-and-error cycles between a first revision and a stable, manufacturable part. Numbers like these come from designing the test vehicle, building it, measuring it, and closing the loop — in one place.
Full design rules, process detail, and build data available under NDA.
Where this fits
Built for hard requirements.
01
Aerospace & Defense
ITAR-aware, MIL-STD qualification, US-soil design and build.
02
Medical & Bio
Miniaturized, qualified hardware where every device counts.
03
RF & mmWave
Eval boards and packaging on the same high-frequency materials.
04
Advanced Sensors
Device design plus firmware bring-up for new sensing hardware.
How we engage
Start where it hurts.
You do not have to hand us the whole thing.
Pick up at design, at the test vehicle, or at packaging — whichever step is the one your program cannot get past. We engage at the point of pain and carry it forward from there.
Process More.
Bring us the part
before it has a package.
One team from schematic to qualified hardware. Request a capability brief for design rules, firmware architecture, and build data under NDA.
/ US-soil / ITAR-aware / MIL-STD