Is Heisler Semiconductor a US-based packaging partner?

Yes. Design, process development, assembly, inspection, and test happen domestically on US soil under one engineering team, with ITAR-aware handling and traceable domestic vendor coordination.

Can you qualify packaging to MIL-STD requirements?

Yes. We run thermal cycling, screening, and hermetic test mapped to the standard a program calls out, and capture process, inspection, metrology, and test data per build for traceability.

Which packaging methods do you support for defense hardware?

Flip chip (C4, C2, Au-stud), wire bond, hermetic packaging, and 3D heterogeneous integration on interposers and substrates, with die placement to plus or minus 2.5 micrometers at 3 sigma.

Do you handle low-volume and prototype defense programs?

Yes. We develop the process on a test vehicle, qualify it, and use structured, documented process transfer so a program can scale from prototype to production-intent without re-qualifying the whole supply chain.

How do you protect sensitive program information?

We engage under NDA. Design rules, full process detail, and build data are shared under NDA, and program work is handled with ITAR-aware controls.

Industries / Aerospace & Defense

Defense-grade, on US soil.

Microelectronics packaging and assembly for aerospace & defense programs – flip chip, wire bond, hermetic, and 3D heterogeneous integration developed, qualified, and built domestically by one engineering team.

Request a capability brief Talk to sales

/ US-soil sourcing / ITAR-aware / MIL-STD when required / full traceability

Die-level microelectronics build for an aerospace and defense program

What defense programs require

Four things, non-negotiable.

A&D buyers do not shop on price first. They qualify a partner on where the work happens, how it is controlled, and whether it survives the mission. We are built for that conversation.

01US-soil sourcing. Design, development, and assembly stay domestic – structured supply chain with traceable, domestic vendor coordination, ITAR-aware handling.
02MIL-STD qualification. Thermal cycling, screening, and hermetic test mapped to the standard your program calls out.
03Hermetic packaging. Sealed assemblies for harsh-environment, long-life, and high-reliability hardware.
04Traceability. Process, inspection, metrology, and test data captured per build – documented and defensible under audit.

Capabilities mapped to the mission

The packaging your payload needs.

From a single RF die to a stacked, heterogeneous module – the assembly methods defense and aerospace electronics actually run on, developed in-house and qualified to your requirement.

Flip chip

High-I/O, low-parasitic interconnect

C4 / C2 / Au-stud bumping, capillary and no-flow underfill, die-to-substrate at fine pitch – for RF, sensing, and compute payloads.

Flip chip →

Wire bond

Proven, qualifiable interconnect

Ball and wedge bonding the defense supply chain already trusts – the workhorse for ruggedized, screen-able assemblies.

Wire bond →

Hermetic

Sealed for the environment

Hermetic packaging and seal verification for long-life hardware that has to survive temperature, vibration, and humidity.

Hermetic packaging →

3D heterogeneous integration

More function, less volume

Stacked and side-by-side die on interposers and substrates – pack more capability into the size, weight, and power your platform allows.

3D-HI →

Inspection & metrology

The proof behind the part

X-ray, 3D AOI, SEM, sub-micron metrology, and cross-section – the data that backs every qualification claim.

Inspection & metrology →

Supply chain & turnkey

One domestic handoff

Domestic sourcing, vendor coordination, and structured process transfer – one accountable US-based partner end to end.

Supply chain →

Materials – Si, sapphire, quartz, AlN, polyimide, thin-film metallization. Wafer 2″–12″. Deeper design rules and process detail available under NDA.

Proof, from real builds

Yield isn't a target. It's the record.

Aviation interposers assembled · 100% yield

>900

Bumps in a single flip-chip package · 100% yield

±2.5µm

Die placement accuracy · 3σ · BESI Datacon, Tresky

Additional case studies, full process detail, and build data available under NDA.

Domestic supply chain

One US partner, not a relay race.

Splitting a program across brokers and offshore shops adds risk at every handoff – lead time, traceability gaps, and parts you cannot fully account for.

We consolidate design support, domestic sourcing, vendor coordination, assembly, inspection, and test under one US-based engineering team. Process transfer is structured and documented, so a program that starts as a prototype scales without re-qualifying the whole chain.

How our domestic supply chain works →

Silicon interposer 3D heterogeneous integration build for aerospace and defense

How we engage

Scoped, under NDA, engineer to engineer.

01 NDA in place – share the requirement, the standard, the environment

02 Feasibility & risk review against your qualification targets

03 Test vehicle, process development, and DOE on US soil

04 Qualification – thermal cycling, screening, hermetic test as called out

05 Documented process transfer to production-intent build

We talk to your engineers, not just procurement.

Tell us the mission profile and the standard you have to meet. We will tell you what is feasible, where the risk is, and what we need to retire it – before you commit a program to it.

ITAR-aware MIL-STD qual Hermetic SPC-controlled US-soil

Process More.

Bring us the program
that has to be built here.

US-soil packaging and assembly, qualified to your standard. Request a capability brief for design rules, full process detail, and build data under NDA.

Request a Capability Brief

/ US-soil / ITAR-aware / MIL-STD