Heisler Insights

Field notes on advanced packaging, process translation, and building hardware that has to survive.

The Next Generation of Manager Wields the Toolkit

The Next Generation of Manager Wields the Toolkit

The next generation of great managers will not be defined by headcount or title. They will be defined by how well they wield the tools. Claude Code, Gemini CLI, Codex these are now part of the working...

Company News Process Insight

Jun 16, 2026

Plating Thickness vs Pull Strength: The Correlation Nobody Logs

Heisler Semiconductor LLC, Tathansh Joshi

Plating Thickness vs Pull Strength: The Correlation Nobody Logs

When wire-bond pull strength comes in low, the instinct is to tune the bonder. More often, the ceiling was set weeks earlier in the plating specification, not at the bonder. Force, ultrasonic energy, ...

Process Insight Wire Bonding

Jun 16, 2026

When Your Assembly House Isn't Your Test House

Heisler Semiconductor LLC, Omkar Gaikwad

When Your Assembly House Isn't Your Test House

The day your assembly house and your test house are two different vendors, you have added a coordination problem to the program whether you planned for it or not. Splitting assembly and test across be...

Multi-Vendor Process Insight

Jun 11, 2026

Field Notes from IMS 2026

Field Notes from IMS 2026

IMS 2026 ran last week in Boston. The most consistent theme across the floor wasnt the die it was the package. Specifically, how much of the engineering that determines whether an RF or microwave syst...

Industry Insight RF Packaging

Jun 10, 2026

Advanced Packaging Is the Bottleneck

Advanced Packaging Is the Bottleneck

For fifty years, more performance meant a smaller transistor. Node scaling still moves but the cost per transistor stopped falling the way it used to, and the gain per node keeps narrowing. The perfor...

Advanced Packaging Industry Insight

Jun 9, 2026

Our New Website Is Live

Our New Website Is Live

We rebuilt heislersemiconductor.com from the ground up cleaner, faster, and organized around how a process engineer actually searches for a packaging shop. The old site told you we exist. The new one ...

Company News

Jun 8, 2026

MCM Build Sequence: Why the Order of Operations Decides Yield

Heisler Semiconductor LLC, Tathansh Joshi

MCM Build Sequence: Why the Order of Operations Decides Yield

A multi-chip module is not built by placing parts. It is built by deciding what happens to which surface, in what order, across a build that touches the substrate dozens of times. On a prototype MCM, ...

Advanced Packaging MCM

Jun 1, 2026

Die Attach: Solder vs Epoxy vs Sinter, and Why CTE Drives the Choice

Heisler Semiconductor LLC, Tathansh Joshi

Die Attach: Solder vs Epoxy vs Sinter, and Why CTE Drives the Choice

Die attach is not a one-material decision. Solder, epoxy, and sintered materials each accommodate CTE mismatch differently and the choice made at attach is what thermal cycling will expose, hundreds o...

Die Attach Process Insight

May 26, 2026

Reshoring Chips Without Reshoring Packaging Is Half a Policy

Reshoring Chips Without Reshoring Packaging Is Half a Policy

The CHIPS Act committed roughly $52 billion to bring semiconductor manufacturing back to the United States. Nearly all of that went to the front end wafers, lithography, the part of the supply chain t...

Industry Insight Reshoring

May 26, 2026

Why We Built Our Inspection Software In-House

Why We Built Our Inspection Software In-House

Inspection data that isnt captured doesnt prevent the next failure. It records the one that already happened. That distinction between a measurement taken and a record that survives the build is why w...

Capability Inspection

May 23, 2026

Wire-Bond Pull Strength: What 8g vs 12g Actually Predicts

Heisler Semiconductor LLC, Tathansh Joshi

Wire-Bond Pull Strength: What 8g vs 12g Actually Predicts

MIL-STD-883 Method 2011 sets the minimum pull strength for 25µm gold wire at 3 grams. An 8g population and a 12g population both pass. They do not predict the same things and treating them as equivale...

Process Insight Wire Bonding

May 20, 2026

The Prototype Volume Gap: From 10 Units to 10,000

The Prototype Volume Gap: From 10 Units to 10,000

Between the university bench and the high-volume OSAT sits a volume band where most real US programs spend their first 12 to 24 months and where almost no domestic capacity is built to serve them. Ten...

Industry Insight Prototyping

May 19, 2026

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