Heisler Semiconductor LLC, Tathansh Joshi Wire Bond Types: Ball vs Wedge, Gold vs Aluminum Ask what type of wire bond a part needs and you get two questions, not one: how the weld is made, and what the wire is made of. Ball or wedge sets the geometry and the tooling. Gold or aluminum sets t... Process Insight Wire Bonding Jul 12, 2026
Heisler Semiconductor LLC, Tathansh Joshi Plating Thickness vs Pull Strength: The Correlation Nobody Logs When wire-bond pull strength comes in low, the instinct is to tune the bonder. More often, the ceiling was set weeks earlier in the plating specification, not at the bonder. Force, ultrasonic energy, ... Process Insight Wire Bonding Jun 16, 2026
Heisler Semiconductor LLC, Tathansh Joshi Wire-Bond Pull Strength: What 8g vs 12g Actually Predicts MIL-STD-883 Method 2011 sets the minimum pull strength for 25µm gold wire at 3 grams. An 8g population and a 12g population both pass. They do not predict the same things and treating them as equivale... Process Insight Wire Bonding May 20, 2026
