Heisler Insights

Taking advanced electronics from idea to a manufacturable product — the manufacturing calls that make or break it.

Advanced Packaging Is the Bottleneck

Advanced Packaging Is the Bottleneck

For fifty years, more performance meant a smaller transistor. Node scaling still moves but the cost per transistor stopped falling the way it used to, and the gain per node keeps narrowing. The perfor...

Advanced Packaging Industry Insight

Jun 9, 2026

Our New Website Is Live

Our New Website Is Live

We rebuilt heislersemiconductor.com from the ground up cleaner, faster, and organized around how a process engineer actually searches for a packaging shop. The old site told you we exist. The new one ...

Company News

Jun 8, 2026

MCM Build Sequence: Why the Order of Operations Decides Yield

Heisler Semiconductor LLC, Tathansh Joshi

MCM Build Sequence: Why the Order of Operations Decides Yield

A multi-chip module is not built by placing parts. It is built by deciding what happens to which surface, in what order, across a build that touches the substrate dozens of times. On a prototype MCM, ...

Advanced Packaging MCM

Jun 1, 2026

Die Attach: Solder vs Epoxy vs Sinter, and Why CTE Drives the Choice

Heisler Semiconductor LLC, Tathansh Joshi

Die Attach: Solder vs Epoxy vs Sinter, and Why CTE Drives the Choice

Die attach is not a one-material decision. Solder, epoxy, and sintered materials each accommodate CTE mismatch differently and the choice made at attach is what thermal cycling will expose, hundreds o...

Die Attach Process Insight

May 26, 2026

Reshoring Chips Without Reshoring Packaging Is Half a Policy

Reshoring Chips Without Reshoring Packaging Is Half a Policy

The CHIPS Act committed roughly $52 billion to bring semiconductor manufacturing back to the United States. Nearly all of that went to the front end wafers, lithography, the part of the supply chain t...

Industry Insight Reshoring

May 26, 2026

Why We Built Our Inspection Software In-House

Why We Built Our Inspection Software In-House

Inspection data that isnt captured doesnt prevent the next failure. It records the one that already happened. That distinction between a measurement taken and a record that survives the build is why w...

Capability Inspection

May 23, 2026

Wire-Bond Pull Strength: What 8g vs 12g Actually Predicts

Heisler Semiconductor LLC, Tathansh Joshi

Wire-Bond Pull Strength: What 8g vs 12g Actually Predicts

MIL-STD-883 Method 2011 sets the minimum pull strength for 25µm gold wire at 3 grams. An 8g population and a 12g population both pass. They do not predict the same things and treating them as equivale...

Process Insight Wire Bonding

May 20, 2026

The Prototype Volume Gap: From 10 Units to 10,000

The Prototype Volume Gap: From 10 Units to 10,000

Between the university bench and the high-volume OSAT sits a volume band where most real US programs spend their first 12 to 24 months and where almost no domestic capacity is built to serve them. Ten...

Industry Insight Prototyping

May 19, 2026

Hermetic Is a Leak Rate You Qualify — Not a Box You Check

Hermetic Is a Leak Rate You Qualify — Not a Box You Check

When people ask what harsh-environment packaging actually means at Heisler, we point to our hermetic work. It is the capability that most defines why we exist: building parts, on US soil, that have to...

Hermetic Packaging Reliability

May 16, 2026

The University-to-Fab Gap Nobody Is Funding

The University-to-Fab Gap Nobody Is Funding

Federal money built the fabs. State programs fund the university research. Almost nothing funds the layer in between the process work that turns a published result into a part a customer can buy. The ...

Lab-to-Fab Process Insight

May 14, 2026

The Six-Month Fabless Delay Nobody Plans For

The Six-Month Fabless Delay Nobody Plans For

Tape-out goes on the calendar in red. Packaging gets four weeks. It is almost never four weeks. We have watched this play out across dozens of fabless programs. The founders are sharp, the silicon is ...

Fabless Process Insight

May 12, 2026

Reshoring Without Packaging Is Incomplete

Reshoring Without Packaging Is Incomplete

Federal funding built the fabs. It mostly didnt fund the step that comes after. A wafer fabbed in the United States, then shipped overseas for dicing, packaging, and assembly, is not a domestic part i...

Industry Insight Reshoring

May 6, 2026

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