Heisler Insights

Field notes on advanced packaging, process translation, and building hardware that has to survive.

Hermetic Is a Leak Rate You Qualify — Not a Box You Check

Hermetic Is a Leak Rate You Qualify — Not a Box You Check

When people ask what harsh-environment packaging actually means at Heisler, we point to our hermetic work. It is the capability that most defines why we exist: building parts, on US soil, that have to...

Hermetic Packaging Reliability

May 16, 2026

The University-to-Fab Gap Nobody Is Funding

The University-to-Fab Gap Nobody Is Funding

Federal money built the fabs. State programs fund the university research. Almost nothing funds the layer in between the process work that turns a published result into a part a customer can buy. The ...

Lab-to-Fab Process Insight

May 14, 2026

The Six-Month Fabless Delay Nobody Plans For

The Six-Month Fabless Delay Nobody Plans For

Tape-out goes on the calendar in red. Packaging gets four weeks. It is almost never four weeks. We have watched this play out across dozens of fabless programs. The founders are sharp, the silicon is ...

Fabless Process Insight

May 12, 2026

Reshoring Without Packaging Is Incomplete

Reshoring Without Packaging Is Incomplete

Federal funding built the fabs. It mostly didnt fund the step that comes after. A wafer fabbed in the United States, then shipped overseas for dicing, packaging, and assembly, is not a domestic part i...

Industry Insight Reshoring

May 6, 2026

MCM RF Assembly: Precision at Every Interconnect

Heisler Semiconductor LLC, Tathansh Joshi

MCM RF Assembly: Precision at Every Interconnect

MCM RF assembly is not about placing parts correctly. It is about building a package where each interconnect decision compounds onto the next and where a single placement error or bond geometry shift ...

Capability MCM

Mar 24, 2026

Die Bonding Is a Reliability Decision, Not a Placement Step

Heisler Semiconductor LLC, Tathansh Joshi

Die Bonding Is a Reliability Decision, Not a Placement Step

A bonded die looks simple at macro scale. At micron scale, every parameter bondline thickness, material system, placement offset is a reliability decision that will be tested each time the device sees...

Capability Die Attach

Feb 24, 2026

Reading a Bond: What Structured Inspection Actually Tells You

Heisler Semiconductor LLC, Tathansh Joshi

Reading a Bond: What Structured Inspection Actually Tells You

A wire bond inspection is not a visual confirmation that a bond exists. Done with structure, it is an engineering measurement that tells you what happened during the bonding process, what the bond wil...

Capability Failure Analysis

Feb 22, 2026

What Customers Actually Buy When They Hire an Advanced Packaging Partner

What Customers Actually Buy When They Hire an Advanced Packaging Partner

Most customers dont arrive with a process specification. They arrive with a device that has to become a product and a risk they cannot afford to carry into hardware. That distinction shapes every enga...

Advanced Packaging Process Insight

Feb 2, 2026

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