Jake Heisler GaN-on-SiC vs GaN-on-Si: What Changes for the Package Two dies can both be GaN and give you completely different packaging problems. The epi layer is the same material; what differs is the substrate it was grown on, and the substrate is what the package ... Advanced Packaging Die Attach Aug 13, 2026
Jake Heisler Flip Chip Underfill: Capillary vs No-Flow, and Why It Decides the Bump Underfill gets scheduled like a finishing operation — bump the wafer, attach the die, then fill the gap. But whether underfill can flow at all is decided by geometry that was frozen at the bump decisi... Advanced Packaging Flip Chip Aug 12, 2026
Jake Heisler Glass-to-Metal Seals and Kovar Lids: Sealing a Sensor That Has to Talk A sensor package is asked to do two contradictory things. It has to seal a cavity against the outside world, and it has to let electrical connections cross that same wall. Every hermetic sensor design... Advanced Sensors Hermetic Packaging Aug 12, 2026
Jake Heisler Hermetic Seal Leak Testing: What MIL-STD-883 Method 1014 Actually Proves "Hermetic" sounds binary and is not. It is a statement about a leak rate — how fast gas crosses the seal — and a package either meets a specified rate or it does not. MIL-STD-883 Method 1014 is the st... Advanced Packaging Hermetic Packaging Aug 12, 2026
Jake Heisler Silver Sinter vs Solder Die Attach: When the Part Runs Hot Solder has a ceiling that is easy to miss on a datasheet. It is not about how well the joint conducts heat — it is that a solder joint's own melting point sets the temperature the finished part can su... Advanced Packaging Die Attach Aug 12, 2026
Jake Heisler Types of Wire Bonding: Ball, Wedge and Ribbon Wire bonding looks like one process with a few settings. It is really three processes that happen to share a machine, and the choice between them is usually made for you — by what metal is on the pad,... Advanced Packaging Wire Bonding Aug 12, 2026
Jake Heisler Eutectic vs Epoxy Die Attach: When To Use Each Almost nobody chooses a die attach method. It arrives with the quote, because the line that priced the build already runs one, and the thermal design quietly forms around that decision. That works unt... Advanced Packaging Die Attach Aug 12, 2026
Jake Heisler C4 Bump Pitch: What Sets the Limit C4 bump pitch has a floor because a molten solder ball spreads as it collapses during reflow — a fixed volume of metal that has to clear its neighbors without bridging. There's no single number: the l... Advanced Packaging Flip Chip Process Insight Aug 5, 2026
Jake Heisler What Is a C4 Bump? Solder Bump Basics for Flip Chip C4 — Controlled Collapse Chip Connection — is a flip-chip interconnect made from solder balls that melt during reflow and self-align the die by surface tension as the molten metal collapses into place... Advanced Packaging Flip Chip Process Insight Aug 5, 2026
Jake Heisler C4 vs Copper Pillar: Choosing the Flip-Chip Bump Most teams do not choose a flip-chip bump. They inherit one, because the substrate vendor quotes what their line already runs and the package quietly forms around that decision. That is fine until pit... Advanced Packaging Flip Chip Process Insight Jul 27, 2026
Jake Heisler Flip Chip on Maskless AlN: Controlling Solder With the Profile, Not a Dam A solder mask does one quietly important job at reflow: it walls the molten alloy in. Take it away and every joint wants to misbehave — bridge to its neighbour, pull off-pad, or starve while the alloy... Flip Chip Process Insight RF Packaging Jul 27, 2026
Heisler Semiconductor LLC, Tathansh Joshi Wire Bond Types: Ball vs Wedge, Gold vs Aluminum Ask what type of wire bond a part needs and you get two questions, not one: how the weld is made, and what the wire is made of. Ball or wedge sets the geometry and the tooling. Gold or aluminum sets t... Process Insight Wire Bonding Jul 12, 2026
