Jake Heisler What Is an OSAT, and When Does a US One Make Sense? OSAT stands for Outsourced Semiconductor Assembly and Test. A fab makes die; an OSAT turns those die into packaged, tested parts you can put on a board. The model exists because assembly and test are ... Advanced Packaging Die Attach Sep 22, 2026
Jake Heisler Eutectic Die Bonding: AuSn, AuSi, and What the Process Actually Requires Eutectic die bonding attaches a die to its substrate with a metallurgical joint — no polymer, no filler — formed by melting a eutectic alloy at a single, sharply defined temperature. A eutectic alloy ... Advanced Packaging Die Attach Sep 21, 2026
Jake Heisler Epoxy Die Attach Process: Dispense, Place, Cure, and What Goes Wrong Epoxy die attach is three steps — dispense the adhesive, place the die, cure the joint — and it is the lower-temperature, more forgiving, lower-cost way to attach a die when the part does not need a m... Die Attach Process Insight Sep 21, 2026
Jake Heisler Die Shear Testing: What MIL-STD-883 Method 2019 Actually Verifies A die shear test pushes sideways on an attached die until it separates from the substrate, and records the force it took. That force is the direct measurement of die-attach strength, and MIL-STD-883 M... Die Attach Failure Analysis Sep 21, 2026
Jake Heisler GaN-on-SiC vs GaN-on-Si: What Changes for the Package Two dies can both be GaN and give you completely different packaging problems. The epi layer is the same material; what differs is the substrate it was grown on, and the substrate is what the package ... Advanced Packaging Die Attach Aug 13, 2026
Jake Heisler Silver Sinter vs Solder Die Attach: When the Part Runs Hot Solder has a ceiling that is easy to miss on a datasheet. It is not about how well the joint conducts heat — it is that a solder joint's own melting point sets the temperature the finished part can su... Advanced Packaging Die Attach Aug 12, 2026
Jake Heisler Eutectic vs Epoxy Die Attach: When To Use Each Almost nobody chooses a die attach method. It arrives with the quote, because the line that priced the build already runs one, and the thermal design quietly forms around that decision. That works unt... Advanced Packaging Die Attach Aug 12, 2026
Heisler Semiconductor LLC, Tathansh Joshi Die Attach: Solder vs Epoxy vs Sinter, and Why CTE Drives the Choice Die attach is not a one-material decision. Solder, epoxy, and sintered materials each accommodate CTE mismatch differently and the choice made at attach is what thermal cycling will expose, hundreds o... Die Attach Process Insight May 26, 2026
Heisler Semiconductor LLC, Tathansh Joshi Die Bonding Is a Reliability Decision, Not a Placement Step A bonded die looks simple at macro scale. At micron scale, every parameter bondline thickness, material system, placement offset is a reliability decision that will be tested each time the device sees... Capability Die Attach Feb 24, 2026
