Jake Heisler GaN-on-SiC vs GaN-on-Si: What Changes for the Package Two dies can both be GaN and give you completely different packaging problems. The epi layer is the same material; what differs is the substrate it was grown on, and the substrate is what the package ... Advanced Packaging Die Attach Aug 13, 2026
Jake Heisler Silver Sinter vs Solder Die Attach: When the Part Runs Hot Solder has a ceiling that is easy to miss on a datasheet. It is not about how well the joint conducts heat — it is that a solder joint's own melting point sets the temperature the finished part can su... Advanced Packaging Die Attach Aug 12, 2026
Jake Heisler Eutectic vs Epoxy Die Attach: When To Use Each Almost nobody chooses a die attach method. It arrives with the quote, because the line that priced the build already runs one, and the thermal design quietly forms around that decision. That works unt... Advanced Packaging Die Attach Aug 12, 2026
Heisler Semiconductor LLC, Tathansh Joshi Die Attach: Solder vs Epoxy vs Sinter, and Why CTE Drives the Choice Die attach is not a one-material decision. Solder, epoxy, and sintered materials each accommodate CTE mismatch differently and the choice made at attach is what thermal cycling will expose, hundreds o... Die Attach Process Insight May 26, 2026
Heisler Semiconductor LLC, Tathansh Joshi Die Bonding Is a Reliability Decision, Not a Placement Step A bonded die looks simple at macro scale. At micron scale, every parameter bondline thickness, material system, placement offset is a reliability decision that will be tested each time the device sees... Capability Die Attach Feb 24, 2026
