We rebuilt heislersemiconductor.com from the ground up — cleaner, faster, and organized around how a process engineer actually searches for a packaging shop.
The old site told you we exist. The new one tells you what we run, the materials we work in, and how a part moves from prototype to qualified volume — on US soil. If you are scoping a build and need to know whether we can run it before you make a call, that answer should be on the site.
What changed
- Capabilities mapped end to end. Flip-chip, wire-bond, die attach, wafer-level, laser processing, hermetic sealing, and failure analysis — each described at the level of the processes and materials we actually run, not a marketing summary.
- An interactive capability map. Navigable by process, material, or package type. Not a static PDF that requires a phone call to interpret.
- AI Automation practice page. We build and run automation tools on our own manufacturing floor. We now offer that engineering work to other manufacturers. The new site explains what that practice does and how it fits into a production operation.
- Direct contact to an engineer. One form. It routes to someone who can answer a technical question — not a general inbox.
Same lab, better front door
Nothing changed in Halethorpe. Same team, same equipment, same process discipline. The prototype programs, qualification builds, and failure investigations we run are exactly what they were. The site now reflects that accurately.
If you were working off an old picture of what Heisler does — or if you have never looked — now is a reasonable time to go through the capabilities pages. And if there is a question the site does not answer, tell us. We would rather fix it than leave the gap.