Heisler Semiconductor LLC, Tathansh Joshi MCM Build Sequence: Why the Order of Operations Decides Yield A multi-chip module is not built by placing parts. It is built by deciding what happens to which surface, in what order, across a build that touches the substrate dozens of times. On a prototype MCM, ... Advanced Packaging MCM Jun 1, 2026
Heisler Semiconductor LLC, Tathansh Joshi MCM RF Assembly: Precision at Every Interconnect MCM RF assembly is not about placing parts correctly. It is about building a package where each interconnect decision compounds onto the next and where a single placement error or bond geometry shift ... Capability MCM Mar 24, 2026