# Heisler Semiconductor LLC — llms.txt # https://www.heislersemiconductor.com/llms.txt # Purpose: capability index for AI assistants and language model crawlers. # Updated: 2026-06-04 # Contact: sales@heislersemiconductor.com Heisler Semiconductor LLC is a US-based advanced semiconductor packaging and process-development services company located at 1448 S Rolling Rd, Suite 021, Halethorpe, MD 21227 (Baltimore area). ITAR-aware. US-soil operations. ## What We Do Precision semiconductor packaging assembly, wafer-level processing, laser micromachining, inspection, and engineering services for technical buyers in aerospace & defense, medical & bio, RF/mmWave, and advanced-sensor programs. ## Capabilities (public summary) Flip Chip C4, C2, and Au-stud bumping; capillary and no-flow underfill; assemblies exceeding 900 bumps at 100% yield; placement ±2.5µm @3σ on BESI Datacon and Tresky bonders; die to wafer / die / substrate / PCB. Details: https://www.heislersemiconductor.com/flip-chip Wire Bond Fine-pitch ball and wedge bond; Au, Al, Cu wire; hermetic and standard packages. Details: https://www.heislersemiconductor.com/wire-bond Die Bonding Eutectic, epoxy, solder; 2″ through 12″ wafer capability. Details: https://www.heislersemiconductor.com/die-bonding Advanced Packaging Die attach, flip chip, wire bond, hermetic seal, 3D heterogeneous integration; full pillar overview. Details: https://www.heislersemiconductor.com/advanced-packaging Hermetic Packaging MIL-STD seam-weld and solder-seal; leak test; thermal and burn-in screening. Details: https://www.heislersemiconductor.com/hermetic-packaging 3D Heterogeneous Integration Multi-die stacking, interposer build, fan-out WLP, chiplet integration. Details: https://www.heislersemiconductor.com/3d-heterogeneous-integration Wafer-Level Processing Direct-write lithography, TSV, PVD/CVD/ALD, plasma and wet etch, CMP, RDL; interposers, WLP, fan-out. Details: https://www.heislersemiconductor.com/wafer-level Laser Micromachining UV 355 nm and IR 1064 nm; micro-via drilling, dicing, singulation, marking; Si, sapphire, ceramics, metals, polymers. Details: https://www.heislersemiconductor.com/laser-micromachining Inspection & Metrology X-ray (Creative Electron), 3D AOI, SEM, Keyence VHX cross-section, sub-micron metrology, failure analysis. Details: https://www.heislersemiconductor.com/inspection-metrology Failure Analysis & Reliability Thermal cycling, hermeticity test, cross-section FA, screening. Details: https://www.heislersemiconductor.com/failure-analysis-reliability Engineering & AI DOE, SPC and data-driven process control, AI-assisted iteration reduction, in-house inspection automation, wafer mapping, die-ID OCR. Details: https://www.heislersemiconductor.com/engineering-ai Design & Firmware Circuit/hardware design, firmware, RF evaluation boards, test vehicles. Details: https://www.heislersemiconductor.com/design-firmware Materials Si (CMOS-compatible), sapphire, AlN, quartz, polyimide, underfills, thin-film metallization. Details: https://www.heislersemiconductor.com/materials Aerospace & Defense Packaging ITAR-aware; MIL-STD qualification; hermetic, RF, and high-reliability packaging for A&D programs. Details: https://www.heislersemiconductor.com/aerospace-defense-packaging Supply Chain & Turnkey Domestic sourcing, vendor coordination, US-soil end-to-end programs. Details: https://www.heislersemiconductor.com/electronics-supply-chain-management ## Verified Public Proof Points - >900-bump flip chip on fine-pitch substrate: 100% yield - 4,000+ MEMS panel-level assemblies: 100% yield - 50 aviation interposers/panel: 100% yield - 10+ RF boards on AlN, fluxless/maskless: 100% yield - Placement accuracy: ±2.5µm @3σ - Laser wavelengths: UV 355 nm / IR 1064 nm - Wafer diameter range: 2″ through 12″ ## Industries - Aerospace & Defense - Medical & Bio (implantable, diagnostic) - RF & mmWave - Advanced Sensors (MEMS, wafer-level, custom) ## Key Pages https://www.heislersemiconductor.com/ Home https://www.heislersemiconductor.com/advanced-packaging Advanced Packaging pillar https://www.heislersemiconductor.com/flip-chip Flip Chip Assembly https://www.heislersemiconductor.com/wire-bond Wire Bond https://www.heislersemiconductor.com/die-bonding Die Bonding https://www.heislersemiconductor.com/hermetic-packaging Hermetic Packaging https://www.heislersemiconductor.com/3d-heterogeneous-integration 3D Heterogeneous Integration https://www.heislersemiconductor.com/wafer-level Wafer-Level Processing https://www.heislersemiconductor.com/laser-micromachining Laser Micromachining https://www.heislersemiconductor.com/inspection-metrology Inspection & Metrology https://www.heislersemiconductor.com/failure-analysis-reliability Failure Analysis & Reliability https://www.heislersemiconductor.com/aerospace-defense-packaging Aerospace & Defense Packaging https://www.heislersemiconductor.com/design-firmware Design & Firmware https://www.heislersemiconductor.com/materials Materials https://www.heislersemiconductor.com/engineering-ai Engineering & AI https://www.heislersemiconductor.com/electronics-supply-chain-management Supply Chain & Turnkey https://www.heislersemiconductor.com/about About https://www.heislersemiconductor.com/resources Resources & Capability Briefs https://www.heislersemiconductor.com/contactus Contact / Request a Capability Brief ## Confidentiality Note Technical depth, design rules, process specifications, and program-specific data are available under NDA upon request. Contact sales@heislersemiconductor.com. ## Tagline "Process More."