FREE 25-PAGE GUIDE
Every US packaging capability, in one guide.
The Heisler Semiconductor Services Guide (2026) is the reference an engineer or program manager reaches for when scoping a build — what we run, how it is qualified, and where each process fits from first article to volume. All assembled on US soil.
INSIDE THE 25 PAGES
- Wire bonding — ball, wedge, and ribbon; fine-pitch and heavy-wire
- Die attach & die bonding — epoxy, eutectic, and sinter; placement accuracy
- Flip-chip — bump and pillar interconnect, underfill, reflow
- Hermetic packaging — seam / seal, lid attach, leak integrity
- RF & mmWave packaging — transitions, controlled impedance, shielding
- Inspection & metrology — X-ray, optical, traceability from proto to volume
/ US-soil assembly / MIL-STD-883 workmanship / prototype → volume / engineer-to-engineer
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WHAT’S INSIDE
Twenty-five pages of packaging capability.
- 01Wire bonding. Ball, wedge, and ribbon bonding; fine-pitch and heavy aluminum wire; the workmanship standard the line runs to and how bonds are pull- and shear-verified.
- 02Die attach & die bonding. Epoxy, eutectic, and sinter attach; placement accuracy; void control and the inspection that proves it.
- 03Flip-chip assembly. Solder-bump and copper-pillar interconnect, underfill families, and reflow — with the substrate and pitch ranges each supports.
- 04Hermetic packaging. Lid and seal attach, seam sealing, and leak-integrity verification for high-reliability parts.
- 05RF & mmWave packaging. Controlled-impedance transitions, grounding and shielding, and the assembly discipline that keeps loss predictable.
- 06Inspection, metrology & traceability. X-ray, optical, and metrology gates, and per-build traceability from first article through volume.
- 07Prototype → volume. How a first-article build locks into a repeatable process on the same line — no re-qualification handoff between houses.
HEISLER//SEMICONDUCTOR
Guide
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WHO IT’S FOR
Written for the person speccing the build.
If you are an engineer or program manager deciding how a device gets packaged — which interconnect, which substrate, which supplier can actually run it — this guide is built to answer those questions before the first conversation.
It is a capability reference, not a brochure: what each process is for, how it is qualified, and where it fits from a first-article build to low-rate production. Use it to shortlist processes for your device, to write a better statement of work, and to know what to ask a US packaging partner before you commit a program.
Process More.
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Email me the guide →/ US-soil assembly / MIL-STD-883 workmanship / prototype → volume / engineer-to-engineer