Jake Heisler Flip Chip on Maskless AlN: Controlling Solder With the Profile, Not a Dam A solder mask does one quietly important job at reflow: it walls the molten alloy in. Take it away and every joint wants to misbehave — bridge to its neighbour, pull off-pad, or starve while the alloy... Flip Chip Process Insight RF Packaging Jul 27, 2026
Jake Heisler Field Notes from IMS 2026 IMS 2026 ran last week in Boston. The most consistent theme across the floor wasnt the die it was the package. Specifically, how much of the engineering that determines whether an RF or microwave syst... Industry Insight RF Packaging Jun 10, 2026