RF Packaging & Design Engineer

About Heisler Semiconductor

Heisler Semiconductor designs and builds advanced semiconductor packages and test hardware for companies and research groups developing RF, mmWave, power, MEMS and sensor devices. We take work from design through assembly and characterization. Demand is growing quickly, especially for RF and mmWave packaging, and we're building the team to meet it.

Location: Baltimore, MD (bwtech@UMBC) · Full-time · On-site

The role

You'll own the RF side of our design work: making sure a die performs once it's in a package, on a board, or in a module. You'll work directly with the founder and our process team, from a customer's first RFQ through design, build and measurement.

What you'll do

• Design RF and mmWave packaging interconnects: wire bond and flip-chip transitions, substrates, launches, and package-to-board interfaces.
• Run EM and circuit simulation (HFSS, Sonnet, ADS or similar) for matching, loss and isolation.
• Lay out evaluation boards and test fixtures, and take them through fabrication.
• Characterize parts on a VNA (S-parameters, de-embedding, fixture calibration) and report the results.
• Review incoming RFQs for technical feasibility and help scope quotes.
• Work alongside our assembly and process engineers to turn designs into builds that yield.

What you need

• BS or MS in Electrical Engineering with RF or microwave coursework or research.
• Hands-on use of at least one EM or RF simulation tool.
• Experience measuring RF hardware with a VNA.
• Clear technical writing, and comfort working directly with customers.

Nice to have

• mmWave (30 GHz+) packaging, flip-chip, or glass/organic interposer experience.
• LNA, PA, filter or coupler design.
• PCB layout (Altium, KiCad or similar).
• Cleanroom or microelectronics assembly exposure.

How to apply

Apply through this page with your resume and a short note on an RF design or measurement project you're proud of.

Heisler Semiconductor is an equal opportunity employer.