Engineering Intern (Unpaid, Academic Credit) — Part-Time

About Heisler Semiconductor

Heisler Semiconductor designs and builds advanced semiconductor packages and test hardware for companies and research groups developing RF, mmWave, power, MEMS and sensor devices. This is an unpaid, for-credit internship built around training: you learn semiconductor packaging hands-on under direct supervision from our engineers, and we work with your school to meet its academic credit requirements.

Location: Halethorpe, MD (bwtech@UMBC) or York, PA · Unpaid, for academic credit · Part-time during the semester (flexible around classes), starting as soon as possible · In-person

Tracks

• Process and packaging: assembly, inspection, process documentation and yield data.
• Nanofab and laser processing: wafer-level processing, thin films and laser work in the cleanroom.
• RF design: packaging interconnects, simulation and VNA measurement.
• PCB and hardware design: evaluation boards, test fixtures and layout.
• Software and data: internal tools, databases, automation and AI in manufacturing workflows.

What you need

• Currently enrolled in an engineering, science or computer science program that grants academic credit for internships.
• Coursework or projects related to your track.
• Care with details and clear written communication.

Eligibility

This role involves export-controlled work and is open to U.S. persons only: U.S. citizens, lawful permanent residents, or protected individuals under 8 U.S.C. 1324b. Heisler Semiconductor does not sponsor employment visas for internships. Status is verified at hire.

How to apply

Apply through this page with your resume, your track, and a short note on a project you built.

Heisler Semiconductor is an equal opportunity employer.