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Senior Package Design Engineer (Substrate & Signal Integrity)

1 open position

About Heisler Semiconductor

Heisler Semiconductor designs and builds advanced semiconductor packages and test hardware for companies and research groups developing RF, mmWave, power, MEMS, sensor and digital ASIC devices. We take work from design through assembly and characterization. Package and substrate design for custom ASICs is our fastest-growing line, and we're building the team to meet it.

Location: Halethorpe, MD (bwtech@UMBC) or York, PA · Full-time · On-site

The role

You'll own the substrate or package a customer's die goes into. You'll take over our in-house substrate design toolchain from the founder, work directly with him and our process team, and carry a program from the customer's first RFQ through design, fabrication, assembly and bring-up.

What you'll do

  • Design laminate FCBGA substrates, fan-out and interposer packages, and leadframe or QFN variants: stackups, bump and ball maps, escape routing, design rules, and fab-ready outputs.
  • Own signal and power integrity for high-speed digital interfaces: impedance-controlled routing, crosstalk, PDN, and channel simulation for SerDes and memory interfaces.
  • Build and check designs in our scripted toolchain (KiCad and Python based) and take them through DRC and substrate fabrication.
  • Lay out evaluation and test boards for packaged parts and run bring-up.
  • Review incoming RFQs for technical feasibility and help scope quotes.
  • Work alongside our assembly and process engineers to turn designs into builds that yield.

What you need

  • BS or MS in Electrical Engineering or a related field.
  • Hands-on package, substrate or high-speed PCB layout (Allegro, APD/SiP Layout, KiCad, Altium or similar) with designs that went to fabrication.
  • Working knowledge of signal-integrity design and at least one SI or EM simulation tool.
  • Clear technical writing, and comfort working directly with customers.

Nice to have

  • FCBGA, Cu-pillar flip-chip, fan-out or glass/organic interposer experience.
  • Substrate vendor interaction: design-rule negotiation, panelization, coupon design.
  • TDR or VNA measurement and de-embedding.
  • Python scripting; cleanroom or microelectronics assembly exposure.

Eligibility

This role involves export-controlled work and is open to U.S. persons only: U.S. citizens, lawful permanent residents, or protected individuals under 8 U.S.C. 1324b. Heisler Semiconductor does not sponsor employment visas for this role. Status is verified at hire.

How to apply

Apply through this page with your resume and a short note on a package, substrate or high-speed board you took to fabrication.

Heisler Semiconductor is an equal opportunity employer.

Halethorpe, MD, United States
Engineering
Full-Time

Process Engineer

1 open position

About Heisler Semiconductor

Heisler Semiconductor designs and builds advanced semiconductor packages and test hardware for companies and research groups developing RF, mmWave, power, MEMS and sensor devices, out of a lab in Halethorpe, MD and a production site in York, PA. We take work from design through assembly and characterization, and our build volume is climbing from prototype lots toward production.

Location: Halethorpe, MD (bwtech@UMBC) or York, PA · Full-time · Split between our Halethorpe lab and our production site in York, PA

The role

You'll own how our parts get built. You'll run and improve our assembly processes, keep production lots on track, and help build out new tools and capabilities in the lab. You'll work directly with the founder and our engineering team.

What you'll do

  • Run and develop assembly processes: dicing, die attach, wire bonding, encapsulation and inspection.
  • Write and maintain process travelers, work instructions and inspection criteria.
  • Track yield and defects, run root-cause investigations and close them out.
  • Do electrical test and characterization on built parts.
  • Oversee production lots from kitting through shipment.
  • Help bring up new equipment and processes in the lab.

What you need

  • BS in Electrical, Materials, Mechanical or Chemical Engineering, or a related field.
  • Hands-on time in a cleanroom, fab, assembly line or electronics lab.
  • Comfort with data: spreadsheets, Python or a stats tool for yield and process data.
  • Careful documentation habits.

Nice to have

  • Wire bonding, die attach, dicing, laser processing or thin-film experience.
  • SPC, DOE or root-cause methods (8D, fishbone).
  • Microscopy, X-ray or other failure analysis.

Eligibility

This role involves export-controlled work and is open to U.S. persons only: U.S. citizens, lawful permanent residents, or protected individuals under 8 U.S.C. 1324b. Heisler Semiconductor does not sponsor employment visas for this role. Status is verified at hire.

How to apply

Apply through this page with your resume and a short note on a process you improved or a build problem you solved.

Heisler Semiconductor is an equal opportunity employer.

Halethorpe, MD, United States
Full-Time

RF Packaging & Design Engineer

1 open position

About Heisler Semiconductor

Heisler Semiconductor designs and builds advanced semiconductor packages and test hardware for companies and research groups developing RF, mmWave, power, MEMS and sensor devices. We take work from design through assembly and characterization. Demand is growing quickly, especially for RF and mmWave packaging, and we're building the team to meet it.

Location: Halethorpe, MD (bwtech@UMBC) or York, PA · Full-time · On-site

The role

You'll own the RF side of our design work: making sure a die performs once it's in a package, on a board, or in a module. You'll work directly with the founder and our process team, from a customer's first RFQ through design, build and measurement.

What you'll do

  • Design RF and mmWave packaging interconnects: wire bond and flip-chip transitions, substrates, launches, and package-to-board interfaces.
  • Run EM and circuit simulation (HFSS, Sonnet, ADS or similar) for matching, loss and isolation.
  • Lay out evaluation boards and test fixtures, and take them through fabrication.
  • Characterize parts on a VNA (S-parameters, de-embedding, fixture calibration) and report the results.
  • Review incoming RFQs for technical feasibility and help scope quotes.
  • Work alongside our assembly and process engineers to turn designs into builds that yield.

What you need

  • BS or MS in Electrical Engineering with RF or microwave coursework or research.
  • Hands-on use of at least one EM or RF simulation tool.
  • Experience measuring RF hardware with a VNA.
  • Clear technical writing, and comfort working directly with customers.

Nice to have

  • mmWave (30 GHz+) packaging, flip-chip, or glass/organic interposer experience.
  • LNA, PA, filter or coupler design.
  • PCB layout (Altium, KiCad or similar).
  • Cleanroom or microelectronics assembly exposure.

Eligibility

This role involves export-controlled work and is open to U.S. persons only: U.S. citizens, lawful permanent residents, or protected individuals under 8 U.S.C. 1324b. Heisler Semiconductor does not sponsor employment visas for this role. Status is verified at hire.

How to apply

Apply through this page with your resume and a short note on an RF design or measurement project you're proud of.

Heisler Semiconductor is an equal opportunity employer.

Halethorpe, MD, United States
Engineering
Full-Time

Power Electronics Design Engineer

1 open position

About Heisler Semiconductor

Heisler Semiconductor designs and builds advanced semiconductor packages and test hardware for companies and research groups developing RF, mmWave, power, MEMS and sensor devices. We take work from design through assembly and characterization. Power packaging is one of our fastest-growing lines, and we're building the team to meet it.

Location: Halethorpe, MD (bwtech@UMBC) or York, PA · Full-time · On-site, with regular travel to partner research labs

The role

You'll lead the power side of our design work: packaging high-voltage wide-bandgap devices so they survive the voltage, heat and switching speed they were built for. You'll work directly with the founder and our process team, from a customer's first RFQ through design, build and test.

What you'll do

  • Design packages and modules for SiC and GaN power devices: substrates, die attach, interconnect, insulation and terminations.
  • Run thermal, electrical and insulation analysis (FEA, parasitic extraction) and design for low inductance and partial-discharge margin.
  • Design test fixtures and run electrical characterization: static, double-pulse and high-voltage testing.
  • Review incoming RFQs for technical feasibility and help scope quotes.
  • Write technical sections for research proposals and funded programs.
  • Work alongside our assembly and process engineers to turn designs into builds that yield.

What you need

  • MS or PhD in Electrical Engineering, or BS with equivalent industry experience, focused on power electronics or power packaging.
  • Hands-on design and build of power modules or packages.
  • Experience with thermal or electromagnetic simulation (ANSYS, COMSOL, Q3D or similar).
  • Experience testing power devices in the lab.
  • Clear technical writing, and comfort working directly with customers.

Nice to have

  • Medium- or high-voltage (≥3.3 kV) packaging and insulation design.
  • Sintered silver, AMB/DBC substrates, or encapsulation process experience.
  • Proposal writing for federal research programs.
  • Cleanroom or microelectronics assembly exposure.

Eligibility

This role involves export-controlled work and is open to U.S. persons only: U.S. citizens, lawful permanent residents, or protected individuals under 8 U.S.C. 1324b. Heisler Semiconductor does not sponsor employment visas for this role. Status is verified at hire.

How to apply

Apply through this page with your resume and a short note on a power package or module you designed and tested.

Heisler Semiconductor is an equal opportunity employer.

Halethorpe, MD, United States
Full-Time
About us

We are a team of passionate people whose goal is to improve everyone's life through disruptive products. We build great products to solve your business problems.