Jake Heisler Field Notes from IMS 2026 IMS 2026 ran last week in Boston. The most consistent theme across the floor wasnt the die it was the package. Specifically, how much of the engineering that determines whether an RF or microwave syst... Industry Insight RF Packaging Jun 10, 2026
Jake Heisler Advanced Packaging Is the Bottleneck For fifty years, more performance meant a smaller transistor. Node scaling still moves but the cost per transistor stopped falling the way it used to, and the gain per node keeps narrowing. The perfor... Advanced Packaging Industry Insight Jun 9, 2026
Jake Heisler Reshoring Chips Without Reshoring Packaging Is Half a Policy The CHIPS Act committed roughly $52 billion to bring semiconductor manufacturing back to the United States. Nearly all of that went to the front end wafers, lithography, the part of the supply chain t... Industry Insight Reshoring May 26, 2026
Jake Heisler The Prototype Volume Gap: From 10 Units to 10,000 Between the university bench and the high-volume OSAT sits a volume band where most real US programs spend their first 12 to 24 months and where almost no domestic capacity is built to serve them. Ten... Industry Insight Prototyping May 19, 2026
Jake Heisler Reshoring Without Packaging Is Incomplete Federal funding built the fabs. It mostly didnt fund the step that comes after. A wafer fabbed in the United States, then shipped overseas for dicing, packaging, and assembly, is not a domestic part i... Industry Insight Reshoring May 6, 2026
