Jake Heisler Gold Wire Bonding: Why Au, Which Diameter, and When Aluminum Wins Gold wire bonding attaches a fine gold wire from a die pad to a package lead using a thermosonic ball bond — heat plus ultrasonic energy, with nothing melting. Gold gets used because it does not oxidi... Advanced Packaging Wire Bonding Sep 21, 2026
Jake Heisler Aluminum Wedge Bonding and Thermocompression: The Two Bonds That Aren't Thermosonic Three wire-bond regimes are in common use, and they differ in exactly one thing: what supplies the energy that welds the wire to the pad. Thermosonic — heat plus ultrasonic scrub — is the one most gol... Advanced Packaging Wire Bonding Sep 21, 2026
Jake Heisler Wire Bonding Service: What to Send, What Comes Back If you have bare die and need them wire bonded to a substrate or package, the two useful questions are what to send and what comes back. This is the checklist version. Send these five things and a wir... Capability Wire Bonding Sep 21, 2026
Jake Heisler Thermosonic Wire Bonding: What It Is, and Who Does It as a Service in the US Thermosonic wire bonding is a solid-state welding process that attaches a fine wire — almost always gold — to a bond pad using ultrasonic energy and heat together, with the part held at roughly 150 °C... Advanced Packaging Wire Bonding Aug 29, 2026
Jake Heisler Types of Wire Bonding: Ball, Wedge and Ribbon Wire bonding looks like one process with a few settings. It is really three processes that happen to share a machine, and the choice between them is usually made for you — by what metal is on the pad,... Advanced Packaging Wire Bonding Aug 12, 2026
Heisler Semiconductor LLC, Tathansh Joshi Wire Bond Types: Ball vs Wedge, Gold vs Aluminum Ask what type of wire bond a part needs and you get two questions, not one: how the weld is made, and what the wire is made of. Ball or wedge sets the geometry and the tooling. Gold or aluminum sets t... Process Insight Wire Bonding Jul 12, 2026
Heisler Semiconductor LLC, Tathansh Joshi Plating Thickness vs Pull Strength: The Correlation Nobody Logs When wire-bond pull strength comes in low, the instinct is to tune the bonder. More often, the ceiling was set weeks earlier in the plating specification, not at the bonder. Force, ultrasonic energy, ... Process Insight Wire Bonding Jun 16, 2026
Heisler Semiconductor LLC, Tathansh Joshi Wire-Bond Pull Strength: What 8g vs 12g Actually Predicts MIL-STD-883 Method 2011 sets the minimum pull strength for 25µm gold wire at 3 grams. An 8g population and a 12g population both pass. They do not predict the same things and treating them as equivale... Process Insight Wire Bonding May 20, 2026
